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Semiconductor Failure Analysis Using Helios PFIB: Webinar
Failure analysis of advanced logic, device packaging, and 3D NAND
Advanced analytical tools specifically designed for failure analysis must be able to quickly handle sample preparation and isolate minor electrical or physical defects – defects that can destroy device performance, reliability, and yield. Such defects become more problematic at the device packaging step, because high-density interconnects and wafer-level stacking mean more places for these defects to hide.
As a result, failure analysis has become a complicated, time-intensive, and laborious task. This is a challenge that current FA tools are struggling to meet.
Register now for this webinar to learn how the Helios 5 PFIB is meeting these challenges. You’ll discover how this tool can help you accelerate your failure analysis and reduce time-to-data to hours, rather than days or weeks. You will also learn how the Helios 5 PFIB provides high sample throughput and high resolution, as well as unmatched automation for advanced logic (< 10 nm), advanced 3D NAND, and advanced packaging.
Who should attend this webinar
Failure Analysis lab managers and engineers at fabless design houses foundries, service labs, and integrated device manufacturers.
What will you learn in this webinar
- Learn how the Helios 5 PFIB supports high throughput preparation of advanced logic, 3D memory and packages.
- Discover how the Helios 5 PFIB delivers unique, automated delayering of memory and logic devices.
- Gain an understanding of how SmartAlign and SEMFLASH increase productivity.
About the Semiconductor SPARK Webinar Series:
Save time, save money, and stay on top of semiconductor technology advancement at SPARK, a knowledge platform from Thermo Fisher Scientific.
SPARK is a collaborative space where industry thought leaders provide their perspective on tool performance and best practices. SPARK establishes a community for professionals who want to easily access actionable semiconductor and microelectronics insights, and gain visibility to state-of-the-art solutions. This includes the latest updates on Thermo Fisher Scientific’s semiconductor products and workflows.
About the speakers:
Micah LeDoux, Product Marketing Specialist, Thermo Fisher Scientific
Micah LeDoux is a Product Marketing Specialist at Thermo Fisher Scientific. During his six years at Thermo Fisher Scientific Micah has gained extensive experience in the FIB/ SEM small dual beam industry working on semiconductor applications. As an Application Development Engineer, he has explored various methods of TEM sample preparation with Ga+ and Xe+ based FIBs, as well as gas enhanced deprocessing of logic and memory devices for nanoprobing and metrology characterization. Micah holds a Bachelor of Science in Physics from Western Washington University and a MSc in Applied Physics from the University of Oregon.
Xiaoting Gu, Semiconductor Solutions Marketing Manager, Thermo Fisher Scientific
Xiaoting Gu is a Semiconductor Solutions Marketing Manager at Thermo Fisher Scientific with a broad experience in semiconductor processing, microelectronics, electroplating and physical metallurgy. Xiaoting has ten-years of experience in FIB/SEM small dual beam applications gained from his time as Sr. Application Development Engineer at Thermo Fisher Scientific in Hillsboro OR, USA and prior to that as a Process Engineer at Lam Research in Fremont CA, USA. Xiaoting holds a Ph.D and MSc in Materials Science and Engineering from Case Western Reserve University and an MBA in Innovation from John Carroll University in Cleveland OH, USA.