Analytical Instruments for Semiconductor Packaging Devices

Metrology and analysis instruments for semiconductor packaging devices

We understand the importance of precise measurements, defect identification, and failure analysis in ensuring the success and reliability of these cutting-edge technologies. With our expertise and advanced instruments, we offer tailored solutions for the unique challenges faced by advanced semiconductor manufacturers. Whether you need to optimize manufacturing processes or overcome technical issues, our team is here to support you. Explore our solutions and let us help drive innovation and excellence in your manufacturing endeavors.

Wafer-level packaging device metrology and defect analysis instruments

Integrating wafer-level analysis into the back end of line and packaging processes allows engineers to obtain quick-turn data on critical information needed including metrology and defect root cause analysis. This is often complementary to a die-level workflow, where the work can be dispositioned based on the urgency of the results needed.

Helios 5 PXL PFIB Wafer DualBeam

The Thermo Scientific Helios 5 PXL Wafer DualBeam is a plasma focused ion beam scanning electron microscope (PFIB-SEM) that features high- performance in-line metrology and process monitoring to quickly provide critical insights for packaging process development and manufacturing engineers.

Helios 5 PXL PFIB Wafer DualBeam

Helios 5 EXL Wafer DualBeam

The Thermo Scientific Helios 5 EXL DualBeam is a 300 mm full-wafer FIB-SEM designed to address wafer-level, site-specific, cross-section SEM and TEM prep defect analysis challenges in the semiconductor packaging industry.

Helios 5 EXL Wafer DualBeam

Talos F200E TEM

The Thermo Scientific Talos F200E TEM provides high-resolution STEM and TEM imaging with minimal distortion, combined with high-throughput energy-dispersive X-ray spectroscopy (EDS) functionality. The Talos F200E TEM enables the imaging and identification of the chemical composition of semiconductor packaging defects.

Talos F200E TEM

Package and die-level fault isolation and physical failure analysis instruments

We offer a wide portfolio of solutions for localizing and electrically characterizing buried defects. These include the Thermo Scientific ELITE System for thermal fault isolation, the Thermo Scientific Meridian System, and the Thermo Scientific nProber System for interconnect and power distribution debug. These systems work in conjunction with our physical failure analysis solutions in a highly effective workflow, providing the most accurate data possible. These solutions include the Thermo Scientific Helios 5 Hydra DualBeam, which enables precision delayering and high throughput milling on a wide range of packaging materials. For atomic-level analysis, the Thermo Scientific Talos F200E TEM combines time-resolved EDS, low-distortion optics, and a simple UI that drastically improves TEM ease of use.

ELITE System

The Thermo Scientific ELITE System utilizes lock-in IR thermography (LIT) to accurately and efficiently locate variations in the local power dissipation that lead to local temperature increases, which provides non-destructive 3D device insights in packages and dies.

ELITE Lock in Thermography System

Helios 5 UC DualBeam

The Thermo Scientific Helios 5 UC DualBeam is a high-performance FIB-SEM that combines the high-resolution Thermo Scientific Elstar UC+ SEM Column with the Thermo Scientific Tomahawk HT FIB Column to deliver fast, precise sample preparation in packaging devices.

Helios 5 UC DualBeam

Helios 5 Hydra DualBeam

The Thermo Scientific Helios 5 Hydra DualBeam features four switchable plasma ion sources (Ar+, Xe+, O+, N+) to perform challenging packaging FA work, including large-volume SEM cross- sections and device delayering, as well as precise, Ga-free TEM sample preparation.

Helios 5 Hydra DualBeam

Talos F200E TEM

The Thermo Scientific Talos F200E TEM provides high-resolution STEM and TEM imaging with minimal distortion, combined with high-throughput energy-dispersive X-ray spectroscopy (EDS) functionality. The Talos F200E TEM enables the imaging and identification of the chemical composition of semiconductor packaging defects.

Talos F200E TEM

Spectra Ultra (S)TEM

The Thermo Scientific Spectra Ultra S(TEM) provides the analytical data needed to answer new materials challenges in the investigation of next-generation semiconductor packaging. The Thermo Scientific Ultra-X Detector shortens elemental mapping time and makes it possible to analyze beam-sensitive structures.

Spectra Ultra (S)TEM

MK Series Systems

The Thermo Scientific MK Series of electrostatic discharge testing systems are designed for ESD and latch-up testing, offering rapid-relay-based operations with up to 2304 channels. They feature advanced device preconditioning with six separate vector drive levels and fully compliant latch-up stimulus and device biasing.

MK Series electrostatic discharge testing systems

For Research Use Only. Not for use in diagnostic procedures.